3D topology optimization of heat sinks for liquid cooling

Sun, Sicheng; Liebersbach, Piotr; Qian, Xiaoping

doi:10.1016/j.applthermaleng.2020.115540

3D topology optimization of heat sinks for liquid cooling

Journal Article · Tue Sep 01 04:00:00 EDT 2020 · Applied Thermal Engineering

DOI:https://doi.org/10.1016/j.applthermaleng.2020.115540· OSTI ID:1634265

Sun, Sicheng; Liebersbach, Piotr; Qian, Xiaoping

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Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA), Office of Naval Reactors

OSTI ID:: 1634265

Journal Information:: Applied Thermal Engineering, Journal Name: Applied Thermal Engineering Journal Issue: C Vol. 178; ISSN 1359-4311

Publisher:: ElsevierCopyright Statement

Country of Publication:: United Kingdom

Language:: English

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