Far-field thermal imaging below diffraction limit
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Purdue Univ., West Lafayette, IN (United States)
- Purdue Univ., West Lafayette, IN (United States)
- Purdue Univ., West Lafayette, IN (United States); Univ. of Cincinnati, OH (United States)
- Univ. Autónoma de Barcelona, Bellaterra, Catalonia (Spain)
Non-uniform self-heating and temperature hotspots are major concerns compromising the performance and reliability of submicron electronic and optoelectronic devices. At deep submicron scales where effects such as contact-related artifacts and diffraction limits accurate measurements of temperature hotspots, non-contact thermal characterization can be extremely valuable. In this work, we use a Bayesian optimization framework with generalized Gaussian Markov random field (GGMRF) prior model to obtain accurate full-field temperature distribution of self-heated metal interconnects from their thermoreflectance thermal images (TRI) with spatial resolution 2.5 times below Rayleigh limit for 530nm illumination. Finite element simulations along with TRI experimental data were used to characterize the point spread function of the optical imaging system. In addition, unlike iterative reconstruction algorithms that use ad hoc regularization parameters in their prior models to obtain the best quality image, we used numerical experiments and finite element modeling to estimate the regularization parameter for solving a real experimental inverse problem.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- AC05-00OR22725
- OSTI ID:
- 1606852
- Journal Information:
- Optics Express, Journal Name: Optics Express Journal Issue: 5 Vol. 28; ISSN 1094-4087; ISSN OPEXFF
- Publisher:
- Optical Society of America (OSA)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
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