Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly

Takken, Todd E.; Zhang, Xin; Yao, Yuan; Ferencz, Andrew

Title: Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly

Patent · Tue Aug 27 00:00:00 EDT 2019

OSTI ID:1576426

Takken, Todd E.; Zhang, Xin; Yao, Yuan; Ferencz, Andrew

A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

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Research Organization:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: B621073

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Number(s):: 10,398,025

Application Number:: 15/808,797

OSTI ID:: 1576426

Resource Relation:: Patent File Date: 2017 Nov 09

Country of Publication:: United States

Language:: English

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