skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Solder assembly of pins to the peripheral end face of a printed circuit board

Patent ·
OSTI ID:1568469
; ; ;

A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
B621073
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
10,321,564
Application Number:
15/808,786
OSTI ID:
1568469
Resource Relation:
Patent File Date: 11/09/2017
Country of Publication:
United States
Language:
English

References (46)

Circuit board assembly and manufacturing method thereof, electronic part assembly and manufacturing method thereof, and electronic device patent-application March 2008
Electronic device patent October 2012
Vertically mountable semiconductor device and methods patent October 2004
Equipment control panel with operation signal generating switch patent February 2001
Printed Wiring Board and Method of Manufacture Thereof patent-application April 2013
Circuit Board with Interconnected Signal Conductors and Interconnected Shielding Conductors August 1968
Edge Contacts of Circuit Boards, and Related Apparatus and Methods patent-application October 2015
Two-dimensional array ultrasonic probe patent-application January 2008
High speed connector assembly with laterally displaceable head portion patent January 2006
Electronic component and semiconductor wafer, and method for producing the same patent September 2008
Control circuit board and circuit structural body patent-application September 2004
Board co-edge coupling with conductive elements patent July 2010
Interconnect transition apparatus patent October 2016
Orthogonal electrical connection using a ball edge array patent August 2004
Connector and Method for Attaching Same to Printed Circuit Board patent September 1970
Circuit board side interconnect patent February 2002
Printed wiring board assembly and related methods patent November 2013
Add-in card edge-finger design/stackup to optimize connector performance patent March 2004
Laminate wiring board patent August 1992
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package patent-application January 2006
Multi-pin edge connector for circuit board patent April 2003
Vertical PCB surface mount inductors and power converters patent January 2013
Printed Circuit Board, Semiconductor Package and Method of Manufacturing the Same patent-application December 2016
Endoscope Apparatus patent-application January 2016
Edge connection structure for printed circuit boards patent May 2009
Wiring board patent-application April 2008
Electronic Device with Edge Surface Antenna Elements and Related Methods patent-application December 2009
Semiconductor device with surface mount package adapted for vertical mounting patent September 1995
Module having vertical peripheral edge connection patent November 1995
Integrated circuit with edge connections and method patent September 1997
Edge launch transition for a printed circuit board patent October 2015
Wiring substrate patent November 2017
Three dimensional package for monolithic microwave/millimeterwave integrated circuits patent August 1996
Semiconductor device including edge bond pads and methods patent May 2001
Electronic component and semiconductor wafer, and method for producing the same patent-application October 2004
Unified Scalable High Speed Interconnects Technologies patent-application December 2010
Electronic Circuit Card with Connector Edge Having Alternated TX and RX Pins Assignment patent-application September 2017
Factorized power architecture with point of load sine amplitude converters patent August 2005
Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board patent June 2001
Printed wiring board having edge plating interconnects patent February 2007
Via pad geometry supporting uniform transmission line structures patent August 2000
Removable Stack Interconnection System patent January 1970
Arrangement for co-planar vertical surface mounting of subassemblies on a mother board patent November 2004
Adapter for surface mounted devices patent July 2001
Component-Embedded Printed Circuit Board, Method of Manufacturing the Same, and Electronic Apparatus Including the Same patent-application November 2009
Method of fabrication of a circuit board adapted to receive a single in-line module patent December 1996

Similar Records

Related Subjects