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Title: High-Resolution Nanoprinting Approach through Self-Driven Electrodeposition

Journal Article · · Journal of the Electrochemical Society
DOI:https://doi.org/10.1149/2.0191901jes· OSTI ID:1559441
ORCiD logo [1];  [2];  [3]
  1. Argonne National Lab. (ANL), Argonne, IL (United States). Chemical Sciences and Engineering Division
  2. California State Univ.-Fresno, Fresno, CA (United States). Dept. of Mechanical Engineering
  3. McGill Univ., Montreal, QC (Canada). Dept of Chemistry

A novel high-resolution nanoprinting method through self-driven electrodeposition is proposed and certain aspects are confirmed with known copper electrochemistry through multiphysics modeling. A series of simulations are conducted involving a nanopipette filled with concentrated CuSO4 solution introduced close to the working electrode (WE) in the cell of diluted CuSO4 electrolyte, where Cu2+ ions diffuse from nanopipette to the electrode and form a limited region with more concentrated cations compared to the rest of the cell. Meanwhile, this process leads to a more positive equilibrium potential of copper redox reaction and thereby local negative surface overpotential on WE. The negative surface overpotential drives the Cu2+ electrodeposition in the form of a nano-protrusion on the target location.

Research Organization:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
AC02-06CH11357
OSTI ID:
1559441
Journal Information:
Journal of the Electrochemical Society, Vol. 166, Issue 1; ISSN 0013-4651
Publisher:
The Electrochemical SocietyCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 1 work
Citation information provided by
Web of Science

References (16)

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Strengths and Advantages of Electrodeposition as a Semiconductor Growth Technique for Applications in Macroelectronic Devices journal January 2006
Spatially-Resolved Interfacial Electrochemistry: Ohmic Microscopy journal May 2008
30 years of electroless plating for semiconductor and polymer micro-systems journal January 2015
Scanning Ion Conductance Microscopy journal July 2012
New advances in ohmic microscopy journal September 2017
Fabrication and Use of Nanopipettes in Chemical Analysis journal June 2018
Combined detection of electrochemical reactions and topographical effects - imaging with scanning ohmic microscopy journal April 2016
Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds journal July 2010
Quantitative Aspects of Ohmic Microscopy journal August 2012
Localized Electrodeposition and Patterning Using Bipolar Electrochemistry journal January 2015
Microwriting of Gold Patterns with the Scanning Electrochemical Microscope journal January 1995
Scanning Ion Conductance Microscopy journal December 2020

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