Large Reduction of Hot Spot Temperature in Graphene Electronic Devices with Heat-Spreading Hexagonal Boron Nitride
Journal Article
·
· ACS Applied Materials and Interfaces
- Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, California 90089, United States
- National Institute for Materials Science, 1-1 Namiki, Tsukuba 305-0044, Japan
Not provided.
- Research Organization:
- Univ. of Southern California, Los Angeles, CA (United States); Univ. of Texas, Austin, TX (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- FG02-07ER46376; FG02-07ER46377
- OSTI ID:
- 1539463
- Journal Information:
- ACS Applied Materials and Interfaces, Vol. 10, Issue 13; ISSN 1944-8244
- Publisher:
- American Chemical Society (ACS)
- Country of Publication:
- United States
- Language:
- English
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