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Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

Journal Article · Sat Oct 01 04:00:00 EDT 2016 · Scripta Materialia

DOI:https://doi.org/10.1016/j.scriptamat.2016.06.008· OSTI ID:1534292

Kim, Gyuseok ^[1]; Chai, Xuzhao; Yu, Le; Cheng, Xuemei; Gianola, Daniel S.

DOE/OSTI

Not provided.

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Research Organization:: Univ. of Pennsylvania, Philadelphia, PA (United States)

Sponsoring Organization:: USDOE Office of Science (SC)

DOE Contract Number:: SC0008135

OSTI ID:: 1534292

Journal Information:: Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: C Vol. 123; ISSN 1359-6462

Publisher:: Elsevier

Country of Publication:: United States

Language:: English

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Related Subjects

Materials Science
Metallurgy & Metallurgical Engineering
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