Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys

Journal Article · Sat Oct 01 00:00:00 EDT 2016 · Scripta Materialia

DOI:https://doi.org/10.1016/j.scriptamat.2016.06.008· OSTI ID:1337760

Kim, Gyuseok; Chai, Xuzhao; Yu, Le; Cheng, Xuemei; Gianola, Daniel S.

Not Available

• Sponsoring Organization: USDOE
• Grant/Contract Number: SC0008135
• OSTI ID: 1337760
• Alternate ID(s): OSTI ID: 1534292
• Journal Information: Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: C Vol. 123; ISSN 1359-6462
• Publisher: Elsevier
• Country of Publication: United States
• Language: English