Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Wang, Wenqing; Meyer, Jacob; Zeng, Qingxuan; Li, Mingyu; Vaezian, Bita; Economy, James

doi:10.1002/pat.3833

Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Journal Article · Wed Jun 22 00:00:00 EDT 2016 · Polymers for Advanced Technologies

DOI:https://doi.org/10.1002/pat.3833· OSTI ID:1533201

Wang, Wenqing ^[1]; Meyer, Jacob ^[2]; Zeng, Qingxuan ^[3]; Li, Mingyu ^[3]; Vaezian, Bita ^[4]; Economy, James ^[5]

Beijing Inst. of Technology (China); Univ. of Illinois at Urbana-Champaign, IL (United States); DOE/OSTI
Univ. of Illinois at Urbana-Champaign, IL (United States); ATSP Innovations, Champaign, IL (United States)
Beijing Inst. of Technology (China)
ATSP Innovations, Champaign, IL (United States)
Univ. of Illinois at Urbana-Champaign, IL (United States)

Copper foils are the vital elements used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO₂ and polyimide, is crucial to functional electronic devices. Liquid-crystalline polymers (LCPs) can be used as substrates for these modules as well as the adhesive to copper foils. The adhesion between aromatic thermosetting copolyester (ATSP)/fiberglass fabric (GF) laminates and copper foils was characterized by peel strength tests. It was found that ATSP/GF laminates with copper foil using ATSP oligomers as adhesive showed a highest average peel strength of 711 N · m^-1. Scanning electron microscope (SEM) and Fourier Transform Infrared Spectroscopy (FTIR) showed an excellent bond between the composite and the copper foil interface. Failure occurred between the backside of the copper foil and the ATSP/GF laminates in the peeling test and the mechanism is discussed. Finally, thermogravimetic analyzer (TGA) indicated a thermal stability up to 371°C for ATSP/GF composite substrate and a glass transition temperature of over 400°C as determined by peak in tan δ during Dynamic Mechanical Analysis (DMA).

View Accepted Manuscript (DOE)

Research Organization:: Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC); National Aeronautics and Space Administration (NASA); China Scholarship Council

Grant/Contract Number:: FG02-91ER45439

OSTI ID:: 1533201

Journal Information:: Polymers for Advanced Technologies, Journal Name: Polymers for Advanced Technologies Journal Issue: 12 Vol. 27; ISSN 1042-7147

Publisher:: WileyCopyright Statement

Country of Publication:: United States

Language:: English

References (26)

A New Concept for Recycling of Thermosetting Resins I: The Case of Crosslinkable Copolyesters Economy, J.; Andreopoulos, A. G. Polymers for Advanced Technologies, Vol. 7, Issue 7 https://doi.org/10.1002/(SICI)1099-1581(199607)7:7<561::AID-PAT506>3.0.CO;2-R	journal	July 1996
Nature of adhesive bonding via interchain transesterification reactions (ITR) Frich, Dan; Hall, Allen; Economy, James Macromolecular Chemistry and Physics, Vol. 199, Issue 5 https://doi.org/10.1002/(SICI)1521-3935(19980501)199:5<913::AID-MACP913>3.0.CO;2-3	journal	May 1998
Dynamic mechanical properties of polyimide/poly(silsesquioxane)-like hybrid films Tsai, Mei-Hui; Whang, Wha-Tzong Journal of Applied Polymer Science, Vol. 81, Issue 10 https://doi.org/10.1002/app.1692	journal	January 2001
Adhesion mechanisms in the solid-state bonding technique using submicrometer aromatic thermosetting copolyester adhesive Xu, Kun; Selby, John C.; Shannon, Mark A. Journal of Applied Polymer Science, Vol. 92, Issue 6 https://doi.org/10.1002/app.20403	journal	January 2004
A new family of low wear, low coefficient of friction polymer blend based on polytetrafluoroethylene and an aromatic thermosetting polyester Zhang, Jing; Demas, Nicholaos G.; Polycarpou, Andreas A. Polymers for Advanced Technologies, Vol. 19, Issue 8 https://doi.org/10.1002/pat.1086	journal	August 2008
Adhesion of an aromatic thermosetting copolyester with copper foils Huang, Yongqing; McCormick, John J.; Economy, James Polymers for Advanced Technologies, Vol. 16, Issue 1 https://doi.org/10.1002/pat.544	journal	January 2005
Induced orientational behavior of liquid crystal polymer by carbon fibers Chung, T. S.; Gurion, Z.; Stamatoff, J. B. Polymer Composites, Vol. 6, Issue 3 https://doi.org/10.1002/pc.750060309	journal	July 1985
Aromatic copolyester thermosets: High temperature adhesive properties Frich, Dan; Economy, James; Goranov, Konstantin Polymer Engineering & Science, Vol. 37, Issue 3 https://doi.org/10.1002/pen.11697	journal	March 1997
Liquid crystal polymer-carbon fiber composites. Molecular orientation Bhama, Satya; Stupp, Samuel I. Polymer Engineering and Science, Vol. 30, Issue 4 https://doi.org/10.1002/pen.760300406	journal	February 1990
Rubber toughened epoxy Ratna, D.; Banthia, Ajit K. Macromolecular Research, Vol. 12, Issue 1 https://doi.org/10.1007/BF03218989	journal	February 2004
Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness Noh, Bo-In; Yoon, Jeong-Won; Lee, Bo-Young Journal of Materials Science: Materials in Electronics, Vol. 20, Issue 9 https://doi.org/10.1007/s10854-008-9811-1	journal	October 2008
An Improved Tribological Polymer-Coating System for Metal Surfaces Zhang, Jing; Polycarpou, Andreas A.; Economy, James Tribology Letters, Vol. 38, Issue 3 https://doi.org/10.1007/s11249-010-9615-3	journal	May 2010
Diffusion and self-adhesion of the polyimide PMDA-ODA Brown, H.; Yang, A.; Russell, T. Polymer, Vol. 29, Issue 10 https://doi.org/10.1016/0032-3861(88)90395-3	journal	October 1988
Failure mechanisms in toughened epoxy resins—A review Garg, Amar C.; Mai, Yiu-Wing Composites Science and Technology, Vol. 31, Issue 3 https://doi.org/10.1016/0266-3538(88)90009-7	journal	January 1988
Preparation and characterization of polyimide/organoclay nanocomposites Delozier, D. Polymer, Vol. 43, Issue 3 https://doi.org/10.1016/S0032-3861(01)00640-1	journal	February 2002
Study on thermoplastic-modified multifunctional epoxies: Influence of heating rate on cure behaviour and phase separation Zhang, Jin; Guo, Qipeng; Fox, Bronwyn L. Composites Science and Technology, Vol. 69, Issue 7-8 https://doi.org/10.1016/j.compscitech.2009.02.016	journal	June 2009
Piperazine and its carboxylic acid derivatives-functionalized mesoporous silica as nanocarriers for gemcitabine: Adsorption and release study Bahrami, Zohreh; Badiei, Alireza; Atyabi, Fatemeh Materials Science and Engineering: C, Vol. 49 https://doi.org/10.1016/j.msec.2014.12.069	journal	April 2015
Hydroxyl terminated poly(ether ether ketone) with pendent methyl group toughened epoxy resin: miscibility, morphology and mechanical properties Francis, Bejoy; Thomas, Sabu; Jose, Jesmy Polymer, Vol. 46, Issue 26 https://doi.org/10.1016/j.polymer.2005.10.103	journal	December 2005
Polyimide modified with metal coupling agent for adhesion application Tsai, Mei-Hui; Lin, Yin-Kai; Chang, Chi-Jung Thin Solid Films, Vol. 517, Issue 17 https://doi.org/10.1016/j.tsf.2009.03.155	journal	July 2009
Novel High-Temperature Aromatic Copolyester Thermosets: Synthesis, Characterization, and Physical Properties Frich, Dan; Goranov, Konstantin; Schneggenburger, Lizabeth Macromolecules, Vol. 29, Issue 24 https://doi.org/10.1021/ma960862d	journal	January 1996
Enhanced interfacial rigidity of 1D thermoset nanostructures by interface-induced liquid crystallinity Duran, Hatice; Yameen, Basit; Geuss, Markus Journal of Materials Chemistry C, Vol. 1, Issue 46 https://doi.org/10.1039/c3tc31055h	journal	January 2013
Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint Wong, Cell K. Y.; Yuen, Matthew M. F.; Xu, Bing Applied Physics Letters, Vol. 94, Issue 26 https://doi.org/10.1063/1.3167358	journal	June 2009
Sub-micrometer solid-state adhesive bonding with aromatic thermosetting copolyesters for the assembly of polyimide membranes in silicon-based devices Selby, J. C.; Shannon, M. A.; Xu, K. Journal of Micromechanics and Microengineering, Vol. 11, Issue 6 https://doi.org/10.1088/0960-1317/11/6/308	journal	October 2001
Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper Liu, Y. X.; Kang, E. T.; Neoh, K. G. IEEE Transactions on Advanced Packaging, Vol. 22, Issue 2 https://doi.org/10.1109/6040.763194	journal	May 1999
Improvement of Adhesion Between Liquid Crystalline Polyester Films by Plasma Treatment Kurihara, Yasuhiro; Ohata, Hiroyuki; Kawaguchi, Masahiko Journal of Adhesion Science and Technology, Vol. 22, Issue 16 https://doi.org/10.1163/156856108X331751	journal	January 2008
Electrical Explosion of Silicon Rod in Distilled Water Cho, Chuhyun; Ha, Yoon-Cheol; Kang, Chungil Japanese Journal of Applied Physics, Vol. 50, Issue 10R https://doi.org/10.7567/JJAP.50.106201	journal	October 2011

Cited By (2)

Reversible Bonding of Aromatic Thermosetting Copolyesters for In‐Space Assembly Meyer, Jacob L.; Bakir, Mete; Lan, Pixiang Macromolecular Materials and Engineering, Vol. 304, Issue 4 https://doi.org/10.1002/mame.201800647	journal	February 2019
Merging versatile polymer chemistry with multifunctional nanoparticles: an overview of crosslinkable aromatic polyester matrix nanocomposites Bakir, Mete; Meyer, Jacob L.; Pang, Siyuan Soft Matter, Vol. 16, Issue 6 https://doi.org/10.1039/c9sm02129a	journal	January 2020

Similar Records

Reversible Bonding of Aromatic Thermosetting Copolyesters for In‐Space Assembly

Journal Article · Tue Feb 05 23:00:00 EST 2019 · Macromolecular Materials and Engineering · OSTI ID:1493642

Tribological studies of a novel high-performance aromatic thermosetting copolyester containing carbon nanotubes for artificial hip joints

Journal Article · Fri Nov 04 00:00:00 EDT 2022 · Tribology International · OSTI ID:2419379

Copper foil adhesion within polyimide/glass multilayer printed wiring boards: Final report

Technical Report · Tue Mar 31 23:00:00 EST 1987 · OSTI ID:6580769

Related Subjects

36 MATERIALS SCIENCE
adhesive strength
aromatic thermosetting
circuit boards
copolyesters
copper foil
polymer science

Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Citation Formats

References (26)

Cited By (2)

Similar Records

Related Subjects