Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Wang, Wenqing; Meyer, Jacob; Zeng, Qingxuan; Li, Mingyu; Vaezian, Bita; Economy, James

doi:10.1002/pat.3833

Title: Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Journal Article · Wed Jun 22 00:00:00 EDT 2016 · Polymers for Advanced Technologies

DOI:https://doi.org/10.1002/pat.3833· OSTI ID:1533201

Wang, Wenqing ^[1]; Meyer, Jacob ^[2]; Zeng, Qingxuan ^[3]; Li, Mingyu ^[3]; Vaezian, Bita ^[4]; Economy, James ^[5]

Beijing Inst. of Technology (China); Univ. of Illinois at Urbana-Champaign, IL (United States)
Univ. of Illinois at Urbana-Champaign, IL (United States); ATSP Innovations, Champaign, IL (United States)
Beijing Inst. of Technology (China)
ATSP Innovations, Champaign, IL (United States)
Univ. of Illinois at Urbana-Champaign, IL (United States)

Copper foils are the vital elements used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO₂ and polyimide, is crucial to functional electronic devices. Liquid-crystalline polymers (LCPs) can be used as substrates for these modules as well as the adhesive to copper foils. The adhesion between aromatic thermosetting copolyester (ATSP)/fiberglass fabric (GF) laminates and copper foils was characterized by peel strength tests. It was found that ATSP/GF laminates with copper foil using ATSP oligomers as adhesive showed a highest average peel strength of 711 N · m^-1. Scanning electron microscope (SEM) and Fourier Transform Infrared Spectroscopy (FTIR) showed an excellent bond between the composite and the copper foil interface. Failure occurred between the backside of the copper foil and the ATSP/GF laminates in the peeling test and the mechanism is discussed. Finally, thermogravimetic analyzer (TGA) indicated a thermal stability up to 371°C for ATSP/GF composite substrate and a glass transition temperature of over 400°C as determined by peak in tan δ during Dynamic Mechanical Analysis (DMA).

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Research Organization:: Univ. of Illinois at Urbana-Champaign, IL (United States)

Sponsoring Organization:: USDOE Office of Science (SC); National Aeronautics and Space Administration (NASA); China Scholarship Council

Grant/Contract Number:: FG02-91ER45439; NNX14CMIOP

OSTI ID:: 1533201

Journal Information:: Polymers for Advanced Technologies, Vol. 27, Issue 12; ISSN 1042-7147

Publisher:: WileyCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 10 works

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Merging versatile polymer chemistry with multifunctional nanoparticles: an overview of crosslinkable aromatic polyester matrix nanocomposites Bakir, Mete; Meyer, Jacob L.; Pang, Siyuan Soft Matter, Vol. 16, Issue 6 https://doi.org/10.1039/c9sm02129a	journal	January 2020

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Related Subjects

36 MATERIALS SCIENCE
polymer science
copper foil
aromatic thermosetting
copolyesters
adhesive strength
circuit boards

Title: Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

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