Alternative Materials for High Temperature Adhesive and Encapsulation Applications.

Conference · Fri Jun 01 00:00:00 EDT 2018

OSTI ID:1530133

Celina, Mathias C.; Martinez, Estevan Jose; Campbell, Christopher; Giron, Nicholas Henry; Astorga, Dominik Jordon; Hernandez, Jose; Linde, Carl Erik; Wyatt, Nicholas B; Grillet, Anne

Abstract not provided.

• Research Organization: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1530133
• Report Number(s): SAND2018-6766C; 664822
• Country of Publication: United States
• Language: English