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High aspect ratio anisotropic silicon etching for x-ray phase contrast imaging grating fabrication

Journal Article · · Materials Science in Semiconductor Processing
 [1];  [1];  [1];  [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
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Lab based x-ray phase contrast imaging (XPCI) systems have historically focused on medical applications, but there is growing interest in material science applications for non-destructive analysis of low density materials. Extending this imaging technique to higher density materials or larger samples requires higher aspect ratio gratings, to allow the use of a higher energy x-ray source. Here, we demonstrate the use of anisotropic silicon (Si) etching in potassium hydroxide (KOH), to achieve extremely high aspect ratio gratings. This method has been shown to be effective in fabricating deep, uniform gratings by taking advantage of the etch selectivity of differing crystalline planes of silicon. Our work has introduced a method for determining Si crystalline plane directions, specific to (110) Si wafers, enabling high alignment accuracy of the etch mask to these crystalline planes.
Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC04-94AL85000; NA0003525
OSTI ID:
1524206
Alternate ID(s):
OSTI ID: 1780136
Report Number(s):
SAND--2018-7120J; 665381
Journal Information:
Materials Science in Semiconductor Processing, Journal Name: Materials Science in Semiconductor Processing Journal Issue: C Vol. 92; ISSN 1369-8001
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English

References (12)

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High aspect ratio metal microcasting by hot embossing for X-ray optics fabrication journal May 2017
Towards sub-micrometer high aspect ratio X-ray gratings by atomic layer deposition of iridium journal May 2018
Phase-contrast imaging and tomography at 60 keV using a conventional x-ray tube source journal May 2009
A crystallographic alignment method in silicon for deep, long microchannel fabrication journal September 2006
A latching accelerometer fabricated by the anisotropic etching of (110) oriented silicon wafers journal March 1992
A novel batch-processing method for accurate crystallographic axis alignment journal April 2013
Precise mask alignment to the crystallographic orientation of silicon wafers using wet anisotropic etching journal June 1996
High-accuracy alignment of the grating pattern along silicon 〈1 1 2〉 directions using a short rectangular array journal May 2017
Fabrication of novel three-dimensional microstructures by the anisotropic etching of journal October 1978
Vertical Etching of Silicon at very High Aspect Ratios journal August 1979
Alignment method combining interference lithography with anisotropic wet etch technique for fabrication of high aspect ratio silicon gratings journal January 2014

Cited By (1)

Tungsten nanoparticles-based x-ray absorption gratings for cascaded Talbot–Lau interferometers journal September 2019

Figures / Tables (7)

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Related Subjects

36 MATERIALS SCIENCE
Anisotropic aqueous silicon etch
Deep Silicon Etching
Potassium Hydroxide Etching
XPCI