High Dielectric Constant Polycarbonate/Nylon Multilayer Films Capacitors with Self-Healing Capability
- Case Western Reserve Univ., Cleveland, OH (United States)
- PolymerPlus, LLC, Valley View, OH (United States)
- SBE, Inc., Barre, VT (United States)
- Brookhaven National Lab. (BNL), Upton, NY (United States)
With the fast development of high-temperature metal oxide semiconductor field effect transistors for power electronics in electric vehicles, current state-of-the-art biaxially oriented polypropylene (BOPP) film capacitors need further improvement because they have a temperature rating of only 85 °C without derating the voltage to maintain a long lifetime. If a high-temperature polymer can replace BOPP without sacrificing the overall dielectric performance and cost, it is possible to remove the current water-cooling system for capacitors and significantly reduce the cost of the power electronic unit. In this work, we demonstrated new polycarbonate (PC)/nylon multilayer films (MLFs), which has a potential for even higher temperature rating because of the higher melting temperature for nylons (e.g., nylon-6). Structural and dielectric studies showed that these PC/nylon MLFs had a similar dielectric performance, such as dielectric constant, dielectric loss, and breakdown strength, as the PC/poly(vinylidene fluoride) PVDF MLFs, which were developed in the past. These PC/nylon MLFs could perform well up to 120 °C, which was limited by the glass transition temperature of PC at 145 °C. Here, more intriguingly, packaged PC/nylon-12 MLF capacitors exhibited a self-healing capability, which had been difficult for packaged high-temperature film capacitors. Because self-healing is such a fundamental requirement for polymer film capacitors, our PC/nylon MLFs offer a potential for next-generation high-temperature and high-energy density film capacitors.
- Research Organization:
- Brookhaven National Laboratory (BNL), Upton, NY (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- Grant/Contract Number:
- SC0012704
- OSTI ID:
- 1513537
- Report Number(s):
- BNL-211617-2019-JAAM
- Journal Information:
- ACS Applied Polymer Materials, Vol. 1, Issue 4; ISSN 2637-6105
- Publisher:
- ACS PublicationsCopyright Statement
- Country of Publication:
- United States
- Language:
- English
PVDF/PMMA dielectric films with notably decreased dielectric loss and enhanced high‐temperature tolerance
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journal | June 2019 |
Enhanced dielectric properties of sandwich‐structured biaxially oriented polypropylene by grafting hyper‐branched aromatic polyamide as surface layers
|
journal | January 2020 |
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