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Title: Low Contact Barrier in 2H/1T' MoTe2 In-Plane Heterostructure Synthesized by Chemical Vapor Deposition

Journal Article · · ACS Applied Materials and Interfaces
ORCiD logo [1]; ORCiD logo [1];  [1]; ORCiD logo [2];  [1]; ORCiD logo [1];  [3]; ORCiD logo [1];  [4];  [1];  [1];  [1]; ORCiD logo [5]; ORCiD logo [6];  [2];  [1]; ORCiD logo [1]; ORCiD logo [3];  [3];  [1]
  1. Rice Univ., Houston, TX (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  3. Northrop Grumman Corp., Redondo Beach, CA (United States)
  4. Rice Univ., Houston, TX (United States); Indian Inst. of Technology Kharagpur, West Bengal (India)
  5. Rice Univ., Houston, TX (United States); Univ. Szeged, Szeged (Hungary)
  6. Rice Univ., Houston, TX (United States); Univ. of Cambridge, Cambridge (United Kingdom)

Metal–semiconductor contact has been an important topic in the semiconductor industry because it influences device performance remarkably. Conventional metals have served as the major contact material in electronic and optoelectronic devices, but such a selection becomes increasingly inadequate for emerging novel materials such as two-dimensional (2D) materials. Deposited metals on semiconducting 2D channels usually form large resistance contacts due to the high Schottky barrier. A few approaches have been reported to reduce the contact resistance but they are not suitable for large-scale application or they cannot create a clean and sharp interface. Here, a chemical vapor deposition (CVD) technique is introduced to produce large-area semiconducting 2D material (2H MoTe2) planarly contacted by its metallic phase (1T' MoTe2). We demonstrate the phase-controllable synthesis and systematic characterization of large-area MoTe2 films, including pure 2H phase or 1T' phase, and 2H/1T' in-plane heterostructure. Theoretical simulation reflects a lower Schottky barrier in 2H/1T' junction than in Ti/2H contact, which is confirmed by electrical measurement. This one-step CVD method to synthesize large-area, seamless-bonding 2D lateral metal–semiconductor junction can improve the performance of 2D electronic and optoelectronic devices, paving the way for large-scale 2D integrated circuits.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES). Scientific User Facilities Division
Grant/Contract Number:
AC05-00OR22725
OSTI ID:
1507842
Journal Information:
ACS Applied Materials and Interfaces, Vol. 11, Issue 13; ISSN 1944-8244
Publisher:
American Chemical Society (ACS)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 47 works
Citation information provided by
Web of Science

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Ultrafast carrier and phonon dynamics in few-layer 2H–MoTe 2 journal September 2019