Computational Models: A Critical Enabler of Advanced Electronic Packaging for Use in High-Reliability Applications.
Conference
·
OSTI ID:1507040
Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1507040
- Report Number(s):
- SAND2018-3574PE; 662184
- Country of Publication:
- United States
- Language:
- English
Similar Records
Predicting the Reliability Of Package-on-Package Interconnections Using Computational Modeling.
PREDICTING THE RELIABILITY OF PACKAGE-ON-PACKAGE INTERCONNECTIONS USING COMPUTATIONAL MODELING SOFTWARE.
Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.
Conference
·
Tue Oct 01 00:00:00 EDT 2013
·
OSTI ID:1140539
PREDICTING THE RELIABILITY OF PACKAGE-ON-PACKAGE INTERCONNECTIONS USING COMPUTATIONAL MODELING SOFTWARE.
Conference
·
Thu Aug 01 00:00:00 EDT 2013
·
OSTI ID:1106678
Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.
Conference
·
Tue Nov 01 00:00:00 EDT 2016
·
OSTI ID:1409913