Graphene heat dissipating structure

Patent · 09 October 2018

OSTI ID:1485287

Washburn, Cody M.; Lambert, Timothy N.; Wheeler, David R.; Rodenbeck, Christopher T.; Railkar, Tarak A.

Various technologies presented herein relate to forming one or more heat dissipating structures (e.g., heat spreaders and/or heat sinks) on a substrate, wherein the substrate forms part of an electronic component. The heat dissipating structures are formed from graphene, with advantage being taken of the high thermal conductivity of graphene. The graphene (e.g., in flake form) is attached to a diazonium molecule, and further, the diazonium molecule is utilized to attach the graphene to material forming the substrate. A surface of the substrate is treated to comprise oxide-containing regions and also oxide-free regions having underlying silicon exposed. The diazonium molecule attaches to the oxide-free regions, wherein the diazonium molecule bonds (e.g., covalently) to the exposed silicon. Attachment of the diazonium plus graphene molecule is optionally repeated to enable formation of a heat dissipating structure of a required height.

• Research Organization: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• Assignee: National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
• Patent Number(s): 10,096,536
• Application Number: 15/618,000
• OSTI ID: 1485287
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE