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Title: Graphene heat dissipating structure

Abstract

Various technologies presented herein relate to forming one or more heat dissipating structures (e.g., heat spreaders and/or heat sinks) on a substrate, wherein the substrate forms part of an electronic component. The heat dissipating structures are formed from graphene, with advantage being taken of the high thermal conductivity of graphene. The graphene (e.g., in flake form) is attached to a diazonium molecule, and further, the diazonium molecule is utilized to attach the graphene to material forming the substrate. A surface of the substrate is treated to comprise oxide-containing regions and also oxide-free regions having underlying silicon exposed. The diazonium molecule attaches to the oxide-free regions, wherein the diazonium molecule bonds (e.g., covalently) to the exposed silicon. Attachment of the diazonium plus graphene molecule is optionally repeated to enable formation of a heat dissipating structure of a required height.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1373709
Patent Number(s):
9,721,867
Application Number:
14/662,091
Assignee:
National Technology & Engineering Solutions of Sandia, LLC SNL-A
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Mar 18
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY

Citation Formats

Washburn, Cody M., Lambert, Timothy N., Wheeler, David R., Rodenbeck, Christopher T., and Railkar, Tarak A. Graphene heat dissipating structure. United States: N. p., 2017. Web.
Washburn, Cody M., Lambert, Timothy N., Wheeler, David R., Rodenbeck, Christopher T., & Railkar, Tarak A. Graphene heat dissipating structure. United States.
Washburn, Cody M., Lambert, Timothy N., Wheeler, David R., Rodenbeck, Christopher T., and Railkar, Tarak A. Tue . "Graphene heat dissipating structure". United States. doi:. https://www.osti.gov/servlets/purl/1373709.
@article{osti_1373709,
title = {Graphene heat dissipating structure},
author = {Washburn, Cody M. and Lambert, Timothy N. and Wheeler, David R. and Rodenbeck, Christopher T. and Railkar, Tarak A.},
abstractNote = {Various technologies presented herein relate to forming one or more heat dissipating structures (e.g., heat spreaders and/or heat sinks) on a substrate, wherein the substrate forms part of an electronic component. The heat dissipating structures are formed from graphene, with advantage being taken of the high thermal conductivity of graphene. The graphene (e.g., in flake form) is attached to a diazonium molecule, and further, the diazonium molecule is utilized to attach the graphene to material forming the substrate. A surface of the substrate is treated to comprise oxide-containing regions and also oxide-free regions having underlying silicon exposed. The diazonium molecule attaches to the oxide-free regions, wherein the diazonium molecule bonds (e.g., covalently) to the exposed silicon. Attachment of the diazonium plus graphene molecule is optionally repeated to enable formation of a heat dissipating structure of a required height.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 01 00:00:00 EDT 2017},
month = {Tue Aug 01 00:00:00 EDT 2017}
}

Patent:

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