Freestanding 3D Mesostructures, Functional Devices, and Shape-Programmable Systems Based on Mechanically Induced Assembly with Shape Memory Polymers
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- Northwestern Univ., Evanston, IL (United States); Univ. of Missouri, Columbia, MO (United States); DOE/OSTI
- Tsinghua Univ., Beijing (China)
- Zhejiang Univ. of Technology, Hangzhou (China)
- Southern Illinois Univ., Carbondale, IL (United States)
- Kyung Hee University, Yongin (South Korea)
- Northwestern Univ., Evanston, IL (United States); Univ. of Missouri, Columbia, MO (United States)
- Northwestern Univ., Evanston, IL (United States)
- Univ. of Illinois at Urbana-Champaign, IL (United States)
- Bristol Univ. (United Kingdom)
- Tsinghua Univ., Beijing (China); Xi'an Jiaotong Univ., Shaanxi (China)
- Zhejiang Univ., Hangzhou (China)
Capabilities for controlled formation of sophisticated 3D micro/nanostructures in advanced materials have foundational implications across a broad range of fields. Recently developed methods use stress release in prestrained elastomeric substrates as a driving force for assembling 3D structures and functional microdevices from 2D precursors. A limitation of this approach is that releasing these structures from their substrate returns them to their original 2D layouts due to the elastic recovery of the constituent materials. Here, a concept in which shape memory polymers serve as a means to achieve freestanding 3D architectures from the same basic approach is introduced, with demonstrated ability to realize lateral dimensions, characteristic feature sizes, and thicknesses as small as ≈500, 10, and 5 µm simultaneously, and the potential to scale to much larger or smaller dimensions. Wireless electronic devices illustrate the capacity to integrate other materials and functional components into these 3D frameworks. Quantitative mechanics modeling and experimental measurements illustrate not only shape fixation but also capabilities that allow for structure recovery and shape programmability, as a form of 4D structural control. These ideas provide opportunities in fields ranging from micro-electromechanical systems and microrobotics, to smart intravascular stents, tissue scaffolds, and others.
- Research Organization:
- University of Illinois at Urbana-Champaign, IL (United States)
- Sponsoring Organization:
- USDOE; USDOE Office of Science (SC)
- Grant/Contract Number:
- FG02-07ER46471
- OSTI ID:
- 1609919
- Alternate ID(s):
- OSTI ID: 1479588
- Journal Information:
- Advanced Materials, Journal Name: Advanced Materials Journal Issue: 2 Vol. 31; ISSN 0935-9648
- Publisher:
- WileyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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