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Gold-Tin Solder Wetting Behavior for Package Lid Seals

Journal Article · · Journal of Electronic Packaging
DOI:https://doi.org/10.1115/1.4039749· OSTI ID:1464180
 [1];  [1];  [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
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This study examined the cause of nonwetted regions of the gold (Au) finish on iron-nickel (Fe–Ni) alloy lids that seal ceramic packages using the 80Au-20Sn solder (wt %, abbreviated Au–Sn) and their impact on the final lid-to-ceramic frame solder joint. The Auger electron spectroscopy (AES) surface and depth profile techniques identified surface and through-thickness contaminants in the Au metallization layer. In one case, the AES analysis identified background levels of carbon (C) contamination on the surface; however, the depth profile detected Fe and Ni contaminants that originated from the plating process. The Fe and Ni could impede the completion of wetting and spreading to the edge of the Au metallization. The Au layer of lids not exposed to a Au–Sn solder reflow step had significant surface and through-thickness C contamination. Inorganic contaminants were absent. Subsequent simulated reflow processes removed the C contamination from the Au layer without driving Ni diffusion from the underlying solderable layer. Finally, an Au metallization having negligible C contamination developed elevated C levels after exposure to a simulated reflow process due to C contamination diffusing into it from the underlying Ni layer. However, the second reflow step removed that contamination from the Au layer, thereby allowing the metallization to support the formation of lid-to-ceramic frame Au–Sn joints without risk to their mechanical strength or hermeticity.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
Grant/Contract Number:
AC04-94AL85000
OSTI ID:
1464180
Report Number(s):
SAND--2017-11856J; 658329
Journal Information:
Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 2 Vol. 140; ISSN 1043-7398
Publisher:
ASMECopyright Statement
Country of Publication:
United States
Language:
English

References (8)

Gold electrodeposition within the electronics industry journal March 1994
AuSn alloy phase diagram and properties related to its use as a bonding medium journal February 1993
Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications journal August 1998
Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates journal January 2012
Au–Sn bonding material for the assembly of power integrated circuit module journal June 2016
Optimization of contact metallizations for reliable wafer level AuSn bonds journal September 2016
An overview of surface finishes and their role in printed circuit board solderability and solder joint performance journal March 1999
Properties of Die Bond Alloys Relating to Thermal Fatigue journal June 1979

Cited By (1)

Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding journal November 2018

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36 MATERIALS SCIENCE