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Nanohardness and chemical bonding of Boron Nitride films

Conference ·

Boron-nitride (BN) films are deposited by the reactive sputter deposition of fully dense, boron targets utilizing a planar magnetron source and an argon-nitrogen working gas mixture. Near-edge x-ray absorption fine structure analysis reveals distinguishing features of chemical bonding within the boron is photoabsorption cross-section. The hardness of the BN film surface is measured using nanoindentation. The sputter deposition conditions as well as the post-deposition treatments of annealing and nitrogen-ion implantation effect the chemical bonding and the film hardness. A model is proposed to quantify the film hardness using the relative peak intensities of the p*-resonances to the boron 1s spectra.

Research Organization:
Lawrence Livermore National Lab., CA (US)
Sponsoring Organization:
USDOE Office of Defense Programs (DP) (US)
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
14546
Report Number(s):
UCRL-JC-131691; KC0201050; KC0201050
Country of Publication:
United States
Language:
English

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