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Configurable double-sided modular jet impingement assemblies for electronics cooling

Patent ·
OSTI ID:1440779
A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.
Research Organization:
Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0006429
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc. (Erlanger, KY)
Patent Number(s):
9,980,415
Application Number:
14/831,208
OSTI ID:
1440779
Country of Publication:
United States
Language:
English

References (4)

Experimental investigation of heat transfer performance for a novel microchannel heat sink journal January 2008
Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds journal May 2013
Manifold microchannel heat sink design using optimization under uncertainty journal February 2014
Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model journal April 2013

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