Modular jet impingement assemblies with passive and active flow control for electronics cooling

Patent · Tue Sep 13 04:00:00 EDT 2016

OSTI ID:1324402

Zhou, Feng; Dede, Ercan Mehmet; Joshi, Shailesh

Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

• Research Organization: Toyota Motor Engineering & Manufacturing North America, Inc. Erlanger, KY (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: EE0006429
• Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
• Patent Number(s): 9,445,526
• Application Number: 14/578,906
• OSTI ID: 1324402
• Country of Publication: United States
• Language: English

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