Packaging system with cleaning channel and method of making the same
A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of the surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- Patent Number(s):
- 9,972,553
- Application Number:
- 15/388,210
- OSTI ID:
- 1440751
- Country of Publication:
- United States
- Language:
- English
Solder Paste Corrosivity Assesment: Bono Test
|
journal | October 2015 |
Similar Records
Packaging of electro-microfluidic devices
Packaging of electro-microfluidic devices