Special Section on InterPACK 2017—Part 2
InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Here, rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly together with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability.
- Research Organization:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
- Grant/Contract Number:
- AC36-08GO28308
- OSTI ID:
- 1438383
- Report Number(s):
- NREL/JA-5400-70997
- Journal Information:
- Journal of Electronic Packaging, Vol. 140, Issue 2; ISSN 1043-7398
- Publisher:
- ASMECopyright Statement
- Country of Publication:
- United States
- Language:
- English
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