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Title: Provisioning cooling elements for chillerless data centers

Patent ·
OSTI ID:1420761

Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0002894
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
9,894,811
Application Number:
15/353,245
OSTI ID:
1420761
Resource Relation:
Patent File Date: 2016 Nov 16
Country of Publication:
United States
Language:
English

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