Provisioning cooling elements for chillerless data centers
Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
- Research Organization:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0002894
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Number(s):
- 9,894,811
- Application Number:
- 15/353,245
- OSTI ID:
- 1420761
- Resource Relation:
- Patent File Date: 2016 Nov 16
- Country of Publication:
- United States
- Language:
- English
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Provisioning cooling elements for chillerless data centers
Provisioning cooling elements for chillerless data centers