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Provisioning cooling elements for chillerless data centers

Patent ·
OSTI ID:1440740
;
Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
Research Organization:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0002894;
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
9,974,213
Application Number:
14/715,944
OSTI ID:
1440740
Country of Publication:
United States
Language:
English

References (4)

Temperature-aware dynamic resource provisioning in a power-optimized datacenter conference March 2010
TAPO: Thermal-aware power optimization techniques for servers and data centers conference September 2011
Optimal heat transfer for liquid cooling with minimal coolant volume conference May 2011
Managing server energy and operational costs in hosting centers
  • Chen, Yiyu; Das, Amitayu; Qin, Wubi
  • SIGMETRICS '05 Proceedings of the 2005 ACM SIGMETRICS international conference on Measurement and modeling of computer systems, Vol. 33, Issue 1, p. 303-314 https://doi.org/10.1145/1064212.1064253
conference June 2005

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