The development of DUV chemically amplified resists

Conference · Fri Dec 31 04:00:00 EST 1993

OSTI ID:141838

Thackeray, J W; Fedynyshyn, T H; Small, R D ^[1]

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1. Shipley Co. Inc., Marlboro, MA (United States)

The development of deep ultraviolet (DUV) resists has necessitated the introduction of new concepts in resist materials and chemistry. Successful DUV resist systems now employ the concept of chemical amplification. This catalytic reaction leads to a substantial enhancement in the imaging dose. Another benefit of chemical amplified resists is that they allow the design of materials which can be transparent to DUV exposure wavelengths, yet they can still have high sensitivity. Commercial and prototype positive- and negative-tone resists are now readily available and these resists have been used in pilot production to make the most advanced integrated circuits with {le}0.35 {mu}m design rules. At Shipley, we have undertaken to develop both negative- and positive-tone chemically amplified resists for DUV lithography. These resists are capable of high resolution (0.3 {mu}m), fast photospeed ({le}30 mJ/sq. cm), and excellent etch resistance. This presentation will discuss the chemical and lithographic properties of the Shipley negative- and positive-tone DUV chemically amplified resists. General discussion of the importance of activation energy for the catalytic process, catalytic chain length, and environmental stability will be given.

• OSTI ID: 141838
• Report Number(s): CONF-930304--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
40 CHEMISTRY
CATALYSIS
CHEMICAL PREPARATION
CHEMICAL PROPERTIES
CHEMICAL RADIATION EFFECTS
MASKING
SURFACE FINISHING
ULTRAVIOLET RADIATION