skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Integratible Process for Fabrication of Fluidic Microduct Networks on a Single Wafer

Abstract

We present a microelectronics fabrication compatible process that comprises photolithography and a key room temperature SiON thin film plasma deposition to define and seal a fluidic microduct network. Our single wafer process is independent of thermo-mechanical material properties, particulate cleaning, global flatness, assembly alignment, and glue medium application, which are crucial for wafer fusion bonding or sealing techniques using a glue medium. From our preliminary experiments, we have identified a processing window to fabricate channels on silicon, glass and quartz substrates. Channels with a radius of curvature between 8 and 50 {micro}m, are uniform along channel lengths of several inches and repeatable across the wafer surfaces. To further develop this technology, we have begun characterizing the SiON film properties such as elastic modulus using nanoindentation, and chemical bonding compatibility with other microelectronic materials.

Authors:
; ; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
13994
Report Number(s):
SAND99-2323C
TRN: AH200114%%272
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: SPIE Microelectronics-Micromachining 1999, Santa Clara, CA (US), 09/20/1999--09/22/1999; Other Information: PBD: 7 Sep 1999
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; ALIGNMENT; SURFACE CLEANING; COMPATIBILITY; FABRICATION; MICROELECTRONICS; SILICON OXIDES; SILICON NITRIDES; DUCTS; SEALS; MINIATURIZATION; MICRODUCT; MICROCHANNEL; MICROFLUIDIC; INTEGRATIBLE; SEALED MICROCHANNEL; MICROFABRICATED CHANNEL; MEMS MICROCHANNEL; ELASTIC MODULUS

Citation Formats

Matzke, C M, Ashby, C I, Bridges, M M, Griego, L, and Wong, C C. Integratible Process for Fabrication of Fluidic Microduct Networks on a Single Wafer. United States: N. p., 1999. Web.
Matzke, C M, Ashby, C I, Bridges, M M, Griego, L, & Wong, C C. Integratible Process for Fabrication of Fluidic Microduct Networks on a Single Wafer. United States.
Matzke, C M, Ashby, C I, Bridges, M M, Griego, L, and Wong, C C. Tue . "Integratible Process for Fabrication of Fluidic Microduct Networks on a Single Wafer". United States. https://www.osti.gov/servlets/purl/13994.
@article{osti_13994,
title = {Integratible Process for Fabrication of Fluidic Microduct Networks on a Single Wafer},
author = {Matzke, C M and Ashby, C I and Bridges, M M and Griego, L and Wong, C C},
abstractNote = {We present a microelectronics fabrication compatible process that comprises photolithography and a key room temperature SiON thin film plasma deposition to define and seal a fluidic microduct network. Our single wafer process is independent of thermo-mechanical material properties, particulate cleaning, global flatness, assembly alignment, and glue medium application, which are crucial for wafer fusion bonding or sealing techniques using a glue medium. From our preliminary experiments, we have identified a processing window to fabricate channels on silicon, glass and quartz substrates. Channels with a radius of curvature between 8 and 50 {micro}m, are uniform along channel lengths of several inches and repeatable across the wafer surfaces. To further develop this technology, we have begun characterizing the SiON film properties such as elastic modulus using nanoindentation, and chemical bonding compatibility with other microelectronic materials.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {9}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

Save / Share: