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Modification of electrical properties of topological insulators

Patent ·
OSTI ID:1377859
Ion implantation or deposition can be used to modify the bulk electrical properties of topological insulators. More particularly, ion implantation or deposition can be used to compensate for the non-zero bulk conductivity due to extrinsic charge carriers. The direct implantation of deposition/annealing of dopants allows better control over carrier concentrations for the purposes of achieving low bulk conductivity. Ion implantation or deposition enables the fabrication of inhomogeneously doped structures, enabling new types of device designs.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Patent Number(s):
9,748,345
Application Number:
15/177,215
OSTI ID:
1377859
Country of Publication:
United States
Language:
English

References (6)

Simple tuning of carrier type in topological insulator Bi2Se3 by Mn doping journal October 2012
p-type Bi2Se3 for topological insulator and low-temperature thermoelectric applications journal May 2009
Ion beam modification of topological insulator bismuth selenide journal December 2014
Colloquium: Topological insulators journal November 2010
Topological Insulator Materials journal October 2013
Review of 3D topological insulator thin-film growth by molecular beam epitaxy and potential applications journal January 2013

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