Prognostics of damage accural in SSL luminaires and drivers subjected to HTSL accelerated aging
- Auburn Univ., AL (United States)
- RTI International, Research Triangle Park, NC (United States)
This paper will show an investigation of off-the-shelf luminaires with the focus on the LED electronic drivers, specifically the aluminum electrolytic capacitors (AECs), that have been aged using high temperature shelf life (HTSL) testing of 135°C in order to prognosticate the remaining useful life of the luminaires. Luminaires have the potential of seeing excessive temperatures when being transported across country or being stored in non-climate controlled warehouses. They are also being used in outdoor applications in desert environments that see little or no humidity but will experience extremely high temperatures during the day. This makes it important to increase our understanding of what effects being stored at high temperatures for a prolonged period of time will have on the usability and survivability of these devices. The U.S. Department of Energy has made a long term commitment to advance the efficiency, understanding and development of solid-state lighting (SSL) and is making a strong push for the acceptance and use of SSL products. In this work, the four AECs of three different types inside each LED electronic driver were studied. The change in capacitance and the change in equivalent series resistance (ESR) of the AECs were measured and considered to be a leading indication of failure of the LED system. These indicators were used to make remaining useful life predictions to develop an algorithm to predict the end of life of the AECs. The luminous flux of a pristine downlight module was also monitored using each LED electronic driver that was subjected to HTSL through the progression of the testing to determine a correlation between the light output of the lamp and the failing components of the LED electronic driver. Prognostic and Health Management (PHM) is a useful tool for assessment of the remaining life of electrical components and is demonstrated for AECs in this work.
- Research Organization:
- RTI International, Research Triangle Park, NC (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0005124
- OSTI ID:
- 1358595
- Resource Relation:
- Conference: ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Burlingame, CA (United States), 16-18 Jul 2013
- Country of Publication:
- United States
- Language:
- English
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