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Title: Modular jet impingement assemblies with passive and active flow control for electronics cooling

Abstract

Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

Inventors:
; ;
Publication Date:
Research Org.:
Toyota Motor Engineering & Manufacturing North America, Inc. Erlanger, KY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1324402
Patent Number(s):
9,445,526
Application Number:
14/578,906
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc. DOEEE
DOE Contract Number:
EE0006429
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Dec 22
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Zhou, Feng, Dede, Ercan Mehmet, and Joshi, Shailesh. Modular jet impingement assemblies with passive and active flow control for electronics cooling. United States: N. p., 2016. Web.
Zhou, Feng, Dede, Ercan Mehmet, & Joshi, Shailesh. Modular jet impingement assemblies with passive and active flow control for electronics cooling. United States.
Zhou, Feng, Dede, Ercan Mehmet, and Joshi, Shailesh. 2016. "Modular jet impingement assemblies with passive and active flow control for electronics cooling". United States. doi:. https://www.osti.gov/servlets/purl/1324402.
@article{osti_1324402,
title = {Modular jet impingement assemblies with passive and active flow control for electronics cooling},
author = {Zhou, Feng and Dede, Ercan Mehmet and Joshi, Shailesh},
abstractNote = {Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2016,
month = 9
}

Patent:

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