Maintaining Low Voiding SolderDie Attach for Power Die While Minimizing Die Tilt.
Conference
·
OSTI ID:1289565
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1289565
- Report Number(s):
- SAND2015-6526C; 598710
- Resource Relation:
- Conference: Proposed for presentation at the IMAPS 2015 - Orlando held October 26-29, 2015 in Orlando, FL.
- Country of Publication:
- United States
- Language:
- English
Similar Records
Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt
Maintaining Low Voiding SolderDie Attach for Power Die While Minimizing Die Tilt.
Design Fabrication and Characterization of Embedded Resistor Heaters for Die Attach on a Multilayer Low Temperature Cofired Ceramic Package.
Conference
·
Thu Oct 01 00:00:00 EDT 2015
·
OSTI ID:1289565
Maintaining Low Voiding SolderDie Attach for Power Die While Minimizing Die Tilt.
Conference
·
Fri Apr 01 00:00:00 EDT 2022
·
OSTI ID:1289565
Design Fabrication and Characterization of Embedded Resistor Heaters for Die Attach on a Multilayer Low Temperature Cofired Ceramic Package.
Conference
·
Sat Mar 01 00:00:00 EST 2008
·
OSTI ID:1289565
+1 more