Structure-property relationships in fluorinated polyimides
- DuPont Electronic Materials, Wilmington, DE (United States)
Over the past several years we have been exploring new fluorinated polyimides for electronics applications. In this paper we explore the effects of fluorine incorporation into polyimides by various methods. These include backbone modification via fluorinated linking groups and/or aromatic ring substitution, and incorporation of pendant fluoroalkyl side chains. Factors such as structural and positional isomerism of certain fluorinated groups on the properties of polyimide films are also considered. The properties investigated include dielectric constant, moisture absorption, thermal expansion coefficient, thermal stability, glass transition temperature, mechanical properties and solubility. The goal of this work has been to define the most fortuitous method of fluorine incorporation that will allow the optimum combination of properties for electronics.
- OSTI ID:
- 126902
- Report Number(s):
- CONF-950402--
- Country of Publication:
- United States
- Language:
- English
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