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Title: Modeling of transient thermoelectric transport in Harman method for films and nanowires

Journal Article · · International Journal of Thermal Sciences

Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI ID:
1251276
Journal Information:
International Journal of Thermal Sciences, Journal Name: International Journal of Thermal Sciences Vol. 89 Journal Issue: C; ISSN 1290-0729
Publisher:
ElsevierCopyright Statement
Country of Publication:
France
Language:
English
Citation Metrics:
Cited by: 9 works
Citation information provided by
Web of Science

References (16)

Thermoelectric characterization by transient Harman method under nonideal contact and boundary conditions journal April 2010
Effect of quantum-well structures on the thermoelectric figure of merit journal May 1993
Special Techniques for Measurement of Thermoelectric Properties journal September 1958
Direct measurement of thin-film thermoelectric figure of merit journal May 2009
Miniaturized TEG with thermal generation of free carriers journal November 2007
Review on measurement techniques of transport properties of nanowires journal January 2013
Thermoelectric properties of Bi2Te3 films by constant and pulsed electrodeposition journal April 2013
Development of Transient Measurement Method for investigating Thermoelectric Properties in High Temperature Region journal November 2006
New thermoelectric components using microsystem technologies journal June 2004
Thin-film thermoelectric devices with high room-temperature figures of merit journal October 2001
New Directions for Low-Dimensional Thermoelectric Materials journal April 2007
Nanoengineering thermoelectrics for 21st century: Energy harvesting and other trends in the field journal August 2013
Evaluation of the Figure of Merit on Thermoelectric Materials by Harman Method journal November 2002
Evaluation of the Figure of Merit of Thermoelectric Modules by Harman Method journal June 2003
Multiple Stage Thermoelectric Generation of Power journal October 1958
One-dimensional Modelling of Thermoelectric Cooling journal November 2002

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