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Title: The Role of Interface Reactions on the Performance of Ball-Grid Array Packages Used in High Reliability Electronics.

Abstract

Abstract not provided.

Authors:
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
OSTI Identifier:
1251135
Report Number(s):
SAND2015-3371PE
583541
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the Lockheed Martin Electronics Packaging Community of Practice Meeting held April 30, 2015 in Syracuse , NY.
Country of Publication:
United States
Language:
English

Citation Formats

Vianco, Paul T. The Role of Interface Reactions on the Performance of Ball-Grid Array Packages Used in High Reliability Electronics.. United States: N. p., 2015. Web.
Vianco, Paul T. The Role of Interface Reactions on the Performance of Ball-Grid Array Packages Used in High Reliability Electronics.. United States.
Vianco, Paul T. Wed . "The Role of Interface Reactions on the Performance of Ball-Grid Array Packages Used in High Reliability Electronics.". United States. doi:. https://www.osti.gov/servlets/purl/1251135.
@article{osti_1251135,
title = {The Role of Interface Reactions on the Performance of Ball-Grid Array Packages Used in High Reliability Electronics.},
author = {Vianco, Paul T.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Apr 01 00:00:00 EDT 2015},
month = {Wed Apr 01 00:00:00 EDT 2015}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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