The Role of Interface Reactions on the Performance of Ball-Grid Array Packages Used in High Reliability Electronics.
Conference
·
OSTI ID:1251135
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1251135
- Report Number(s):
- SAND2015-3371PE; 583541
- Resource Relation:
- Conference: Proposed for presentation at the Lockheed Martin Electronics Packaging Community of Practice Meeting held April 30, 2015 in Syracuse , NY.
- Country of Publication:
- United States
- Language:
- English
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