A study of adhesion at the E-glass/FR4 interface

Technical Report · Tue Oct 31 23:00:00 EST 1995

DOI:https://doi.org/10.2172/125094· OSTI ID:125094

Kent, M S; Baca, P; McNarama, W F; Jones, G; Fein, D; Wright, W ^[1]; Domeier, L ^[2]; Wu, W L ^[3]; Wong, A ^[4]

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1. Sandia National Labs., Albuquerque, NM (United States)
2. Sandia National Labs., Livermore, CA (United States)
3. National Inst. of Standards and Technology, Gaithersburg, MD (United States)
4. Argonne National Lab., IL (United States)

The majority of printed circuit boards are copper clad laminates composed of fiberglass cloth impregnated with FR4 epoxy. An important factor affecting the reliability of these assemblies is the integrity of the epoxy/glass fiber interface. The goal of this work is to investigate mechanisms for the loss of adhesive strength between E-glass and FR4 epoxy upon humidity and temperature conditioning. In this paper the authors discuss the distribution of moisture between the interface region and the bulk epoxy examined by neutron reflection, and the relationship of this data to adhesive strength.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States); Argonne National Lab., IL (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000; W-31109-ENG-38
• OSTI ID: 125094
• Report Number(s): SAND--95-2393C; CONF-951033--24; ON: DE96002075
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
ADHESION
COMPOSITE MATERIALS
EPOXIDES
EXPERIMENTAL DATA
FAILURES
FIBERGLASS
INTERFACES
MECHANICAL TESTS
PRINTED CIRCUITS
RELIABILITY
TENSILE PROPERTIES