Contributions of stress and oxidation on the formation of whiskers in Pb-free solders
- Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)
Understanding the environmental factors influencing formation of tin whiskers on electrodeposited lead free, tin coatings over copper (or copper containing) substrates is the topic of this study . An interim report* summarized initial observations as to the role of stress and oxide formation on whisker growth. From the initial results, two main areas were chosen to be the focus of additional research: the demonstration of effects of elastic stress state in the nucleation of whiskers and the confirmation of the effect of oxygen content in the formation of whiskers. Different levels of elastic stress were induced with the incorporation of a custom designed fixture that loaded the sample in a four-point bending configuration and were maintained in an environmental chamber under conditions deemed favorable for whisker growth. The effects of oxygen content were studied by aging substrates in gas vials of varying absolute pressure and different oxygen partial pressure.
- Research Organization:
- Savannah River Site (SRS), Aiken, SC (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC09-08SR22470
- OSTI ID:
- 1237312
- Report Number(s):
- SRNL-STI--2014-00120
- Country of Publication:
- United States
- Language:
- English
Similar Records
Contributions of Stress And Oxidation on the Formation of Whiskers in Pb-Free Solders
Suppressing tin whisker growth in lead-free solders and platings
EVALUATION OF LOCAL STRAIN EVOLUTION FROM METALLIC WHISKER FORMATION
Technical Report
·
Tue Mar 25 00:00:00 EDT 2014
·
OSTI ID:1124778
Suppressing tin whisker growth in lead-free solders and platings
Patent
·
Tue Apr 29 00:00:00 EDT 2014
·
OSTI ID:1130083
EVALUATION OF LOCAL STRAIN EVOLUTION FROM METALLIC WHISKER FORMATION
Journal Article
·
Wed May 11 00:00:00 EDT 2011
· Scripta Materialia
·
OSTI ID:1013351