Suppressing tin whisker growth in lead-free solders and platings
Patent
·
OSTI ID:1130083
A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
- Research Organization:
- Savannah River Site (SRS), Aiken, SC (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC09-08SR22470
- Assignee:
- Savannah River Nuclear Solutions, LLC (Aiken, SC)
- Patent Number(s):
- 8,709,179
- Application Number:
- 13/269,803
- OSTI ID:
- 1130083
- Country of Publication:
- United States
- Language:
- English
Spontaneous whisker growth on lead-free solder finishes
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journal | November 2005 |
Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits
|
journal | November 2005 |
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