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Using atomic layer deposited tungsten to increase thermal conductivity of a packed bed

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4917309· OSTI ID:1342071
This paper investigated the effective thermal conductivity (keff) of packed-beds that contained porous particles with nanoscale tungsten (W) films of different thicknesses formed by atomic layer deposition (ALD). A continuous film on the particles is vital towards increasing keff of the packed beds. For example, the keff of an alumina packed bed was increased by three times after an ~8-nm continuous W film with 20 cycles of W ALD, whereas keff was decreased on a polymer packed bed with discontinuous, evenly dispersed W-islands due to nanoparticle scattering of phonons. For catalysts, understanding the thermal properties of these packed beds is essential for developing thermally conductive supports as alternatives to structured supports.
Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE Advanced Research Projects Agency - Energy (ARPA-E)
Grant/Contract Number:
AC52-07NA27344; AR0000291
OSTI ID:
1342071
Alternate ID(s):
OSTI ID: 1226735
OSTI ID: 22398906
Report Number(s):
LLNL-JRNL--665861
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 15 Vol. 106; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English

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