Using atomic layer deposited tungsten to increase thermal conductivity of a packed bed

Journal Article · Mon Apr 13 04:00:00 EDT 2015 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.4917309· OSTI ID:22398906

Van Norman, Staci A.; Falconer, John L.; Tringe, Joseph W.; Sain, John D. ^[1]; Yang, Ronggui ^[2]

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1. Lawrence Livermore National Laboratory, 7000 East Ave, Livermore, California 94550 (United States)
2. Department of Mechanical Engineering, University of Colorado, UCB 427, Boulder, Colorado 80309-0427 (United States)

This study investigated the effective thermal conductivity (k{sub eff}) of packed-beds that contained porous particles with nanoscale tungsten (W) films of different thicknesses formed by atomic layer deposition (ALD). A continuous film on the particles is vital towards increasing k{sub eff} of the packed beds. For example, the k{sub eff} of an alumina packed bed was increased by three times after an ∼8-nm continuous W film with 20 cycles of W ALD, whereas k{sub eff} was decreased on a polymer packed bed with discontinuous, evenly dispersed W-islands due to nanoparticle scattering of phonons. For catalysts, understanding the thermal properties of these packed beds is essential for developing thermally conductive supports as alternatives to structured supports.

• OSTI ID: 22398906
• Journal Information: Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 15 Vol. 106; ISSN APPLAB; ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALUMINIUM OXIDES
CATALYSTS
DEPOSITION
LAYERS
NANOSTRUCTURES
PACKED BEDS
PHONONS
POLYMERS
POROUS MATERIALS
SCATTERING
THERMAL CONDUCTIVITY
THICKNESS
THIN FILMS
TUNGSTEN