Thermal flux limited electron Kapitza conductance in copper-niobium multilayers

Cheaito, Ramez; Hattar, Khalid Mikhiel; Gaskins, John T.; Yadav, Ajay K.; Duda, John C.; Beechem, III, Thomas Edwin; Ihlefeld, Jon; Piekos, Edward S.; Baldwin, Jon K.; Misra, Amit; Hopkins, Patrick E.

doi:10.1063/1.4913420

Thermal flux limited electron Kapitza conductance in copper-niobium multilayers

Journal Article · Thu Mar 05 00:00:00 EST 2015 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.4913420· OSTI ID:1183079

Cheaito, Ramez ^[1]; Hattar, Khalid Mikhiel ^[2]; Gaskins, John T. ^[1]; Yadav, Ajay K. ^[3]; Duda, John C. ^[1]; Beechem, III, Thomas Edwin ^[2]; Ihlefeld, Jon ^[2]; Piekos, Edward S. ^[2]; Baldwin, Jon K. ^[4]; Misra, Amit ^[5]; Hopkins, Patrick E. ^[1]

Univ. of Virginia, Charlottesville, VA (United States)
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Univ. of California, Berkeley, CA (United States)
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Univ. of Michigan, Ann Arbor, MI (United States)

The interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers was studied. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffuse mismatch model. The results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.

View Accepted Manuscript (DOE)

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States

Sponsoring Organization:: USDOE; USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: AC04-94AL85000

OSTI ID:: 1183079

Alternate ID(s):: OSTI ID: 1420541
OSTI ID: 22412772

Report Number(s):: SAND--2014-16696J; 534589

Journal Information:: Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 09 Vol. 106; ISSN 0003-6951

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

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