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Title: Thermal flux limited electron Kapitza conductance in copper-niobium multilayers

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4913420· OSTI ID:1183079
 [1];  [2];  [1];  [3];  [1];  [2];  [2];  [2];  [4];  [5];  [1]
  1. Univ. of Virginia, Charlottesville, VA (United States)
  2. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  3. Univ. of California, Berkeley, CA (United States)
  4. Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
  5. Univ. of Michigan, Ann Arbor, MI (United States)

We study the interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffuse mismatch model. Our results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.

Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
Grant/Contract Number:
AC04-94AL85000
OSTI ID:
1183079
Alternate ID(s):
OSTI ID: 1420541
Report Number(s):
SAND-2014-16696J; 534589
Journal Information:
Applied Physics Letters, Vol. 106, Issue 09; ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 20 works
Citation information provided by
Web of Science

References (30)

Nanoscale thermal transport journal January 2003
Thermal boundary resistance journal July 1989
Thermal Transport across Solid Interfaces with Nanoscale Imperfections: Effects of Roughness, Disorder, Dislocations, and Bonding on Thermal Boundary Conductance journal January 2013
Energy dissipation and transport in nanoscale devices journal March 2010
Tuning Phonon Transport: From Interfaces to Nanostructures journal May 2013
Design of radiation resistant metallic multilayers for advanced nuclear systems journal June 2014
Design of Radiation Tolerant Nanostructured Metallic Multilayers journal August 2012
Field-dependent thermoelectric power and thermal conductivity in multilayered and granular giant magnetoresistive systems journal December 1996
Field-dependent thermal and electrical transports in Cu∕CoFe multilayer journal March 2006
Perpendicular-current studies of electron transport across metal/metal interfaces journal October 2009
Measurements of transport properties of Ag/Al and Ag/Cu multilayered films journal September 1993
Experimental Validation of the Interfacial Form of the Wiedemann-Franz Law journal June 2012
Role of electron–phonon coupling in thermal conductance of metal–nonmetal interfaces journal June 2004
Electronic Kapitza conductance due to inelastic electron-boundary scattering journal October 1998
Spectral analysis of thermal boundary conductance across solid/classical liquid interfaces: A molecular dynamics study journal July 2014
Effects of electron scattering at metal-nonmetal interfaces on electron-phonon equilibration in gold films journal January 2009
Thermal conductance of metal-metal interfaces journal December 2005
Effects of subconduction band excitations on thermal conductance at metal-metal interfaces journal January 2010
Time-resolved thermal transport in compositionally modulated metal films journal January 1988
Electrons and Phonons book January 2001
Thermal-conductivity measurements of GaAs/AlAs superlattices using a picosecond optical pump-and-probe technique journal March 1999
Thermal conductivity of Si/SiGe and SiGe/SiGe superlattices journal March 2002
Ultra-Low Thermal Conductivity in W/Al2O3 Nanolaminates journal February 2004
Heat-Transport Mechanisms in Superlattices journal February 2009
A thermodynamic analysis of the binary alloy systems Cu-Cr, Cu-Nb and Cu-V journal April 1990
Unusual alloying behavior at the equilibrium immiscible Cu–Nb interfaces journal September 2004
Thermal stability of self-supported nanolayered Cu/Nb films journal April 2004
Analysis of heat flow in layered structures for time-domain thermoreflectance journal December 2004
Pulse accumulation, radial heat conduction, and anisotropic thermal conductivity in pump-probe transient thermoreflectance journal November 2008
Criteria for Cross-Plane Dominated Thermal Transport in Multilayer Thin Film Systems During Modulated Laser Heating journal May 2010

Cited By (7)

A Review of Experimental and Computational Advances in Thermal Boundary Conductance and Nanoscale Thermal Transport across Solid Interfaces journal August 2019
Femtosecond laser generation of microbumps and nanojets on single and bilayer Cu/Ag thin films journal January 2019
Thin Ti adhesion layer breaks bottleneck to hot hole relaxation in Au films journal May 2019
Spatially resolved thermoreflectance techniques for thermal conductivity measurements from the nanoscale to the mesoscale journal October 2019
Titanium contacts to graphene: process-induced variability in electronic and thermal transport journal February 2018
Determining heat-transfer coefficients of solid objects by laser photothermal IR radiometry journal July 2017
Titanium Contacts to Graphene: Process-Induced Variability in Electronic and Thermal Transport text January 2017

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