Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)

Li, Xiuling; Huang, Wen

Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)

Patent · Tue Apr 28 04:00:00 EDT 2015

OSTI ID:1178676

Li, Xiuling; Huang, Wen

A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. The conductive pattern layer comprises a first conductive film and a second conductive film separated from the first conductive film in a rolling direction. In the rolled configuration, the first conductive film surrounds the longitudinal axis, and the second conductive film surrounds the first conductive film. The first conductive film serves as a signal line and the second conductive film serves as a conductive shield for the rolled-up transmission line structure.

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Research Organization:: The Board of Trustees of the University of Illinois, Urbana, IL (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: FG02-07ER46471

Assignee:: The Board of Trustees of the University of Illinois (Urbana, IL)

Patent Number(s):: 9,018,050

Application Number:: 14/051,192

OSTI ID:: 1178676

Country of Publication:: United States

Language:: English

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