Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Methods for improved growth of group III nitride semiconductor compounds

Patent ·
OSTI ID:1172761

Methods are disclosed for growing group III-nitride semiconductor compounds with advanced buffer layer technique. In an embodiment, a method includes providing a suitable substrate in a processing chamber of a hydride vapor phase epitaxy processing system. The method includes forming an AlN buffer layer by flowing an ammonia gas into a growth zone of the processing chamber, flowing an aluminum halide containing precursor to the growth zone and at the same time flowing additional hydrogen halide or halogen gas into the growth zone of the processing chamber. The additional hydrogen halide or halogen gas that is flowed into the growth zone during buffer layer deposition suppresses homogeneous AlN particle formation. The hydrogen halide or halogen gas may continue flowing for a time period while the flow of the aluminum halide containing precursor is turned off.

Research Organization:
Applied Materials, Inc., Santa Clara, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0003331
Assignee:
Applied Materials, Inc. (Santa Clara, CA)
Patent Number(s):
8,980,002
Application Number:
13/469,045
OSTI ID:
1172761
Country of Publication:
United States
Language:
English

References (25)

Thermodynamic and experimental investigations on the growth of thick aluminum nitride layers by high temperature CVD journal June 2009
Thermodynamics and Kinetics of Chemical Vapor Deposition of Aluminum Nitride Films journal January 1980
MOVPE-like HVPE of AlN using solid aluminum trichloride source journal January 2007
Growth of Bulk GaN and AlN: Progress and Challenges journal July 2010
Cluster Size Determination in the Chemical Vapor Deposition of Aluminum Nitride journal August 1994
Growth and design of deep-UV (240–290nm) light emitting diodes using AlGaN alloys journal December 2004
AIN/GaN and AIGaN/GaN Heterostructures Grown by HVPE on SiC Substrates journal January 1997
Epitaxially grown AlN and its optical band gap journal January 1973
Gas-phase synthesis of AlN powders from AlCl3-NH3-N2 journal January 1993
Composition, Kinetics, and Mechanism of Growth of Chemical Vapor-Deposited Aluminum Nitride Films journal January 1982
The Preparation and Properties of Aluminum Nitride Films journal January 1975
THE PREPARATION AND PROPERTIES OF VAPOR‐DEPOSITED SINGLE‐CRYSTAL‐LINE GaN journal November 1969
The Chemical Vapor Deposition of Aluminum Nitride:  Unusual Cluster Formation in the Gas Phase journal June 1997
Aluminum nitride substrate growth by halide vapor transport epitaxy journal March 2003
Modeling analysis of AlN and AlGaN HVPE journal May 2009
Effect of process parameters on synthesis of aluminum nitride powder prepared by chemical vapor deposition journal January 2001
Modeling of gas phase and surface reactions in an aluminum nitride growth system journal July 2006
AlN substrates: fabrication via vapor phase growth and characterization journal November 2003
Growth of thick AlN layers by hydride vapor-phase epitaxy journal July 2005
Growth kinetics, structure and surface morphology of AlN/α-Al2O3 epitaxial layers journal January 1987
Epitaxial growth of aluminum nitride journal October 1967
Epitaxial growth and electrical properties of GaN-AlN solid solutions journal January 1977
Growth of the AlN nano-pillar crystal films by means of a halide chemical vapor deposition under atmospheric pressure journal July 2004
Chemical vapour deposition of polycrystalline AlN films from AlCl3–NH3 mixtures. journal March 2002
Micro freef-low IEF enhanced by active cooling and functionalized gels journal December 2006