The Effect of Partial Solder Filling on Thermal-Mechanical Fatigue of Cu-Plated Through Holes.
Journal Article
·
· International Journal of Materials and Structural Integrity
OSTI ID:1146157
- Sandia National Laboratories, Kansas City, MO
Abstract not provided.
- Research Organization:
- Sandia National Laboratories Kansas City, MO; Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1146157
- Report Number(s):
- SAND2007-7607J; 520177
- Journal Information:
- International Journal of Materials and Structural Integrity, Journal Name: International Journal of Materials and Structural Integrity
- Country of Publication:
- United States
- Language:
- English
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