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Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules.

Journal Article · Thu Feb 28 23:00:00 EST 2013 · IEEE Transactions

DOI:https://doi.org/10.1109/TEMC.2013.2265049· OSTI ID:1145223

Rodenbeck, Christopher T.; Peterson, Kenneth A; Sandoval, Charles E.; Russick, Edward Mark; Ortiz, Ray A.; Brakora, Karl; Thiessen, Jack

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Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 1145223

Report Number(s):: SAND2013-1921J; 441969

Journal Information:: IEEE Transactions, Journal Name: IEEE Transactions

Country of Publication:: United States

Language:: English

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