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Electrooptical Inspection of Vector Leakage in Radiofrequency Multichip Modules.

Journal Article · Thu Sep 01 00:00:00 EDT 2011 · IEEE Microwave and Wireless Components Letters

OSTI ID:1106552

Rodenbeck, Christopher T.; Peterson, Kenneth A.; Sandoval, Charles E.; Russick, Edward M.; Ortiz, Ray A.; Brakora, Karl; Thiessen, Jack

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Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 1106552

Report Number(s):: SAND2011-6724J; 464633

Journal Information:: IEEE Microwave and Wireless Components Letters, Journal Name: IEEE Microwave and Wireless Components Letters

Country of Publication:: United States

Language:: English

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