Wafer-Level Step-Stressing of InGaP/GaAs HBTs.

Conference · Thu May 01 00:00:00 EDT 2014

OSTI ID:1143307

Baca, Albert G.; Kotobi, Joshua Ali; Fortune, Torben Ray; Gorenz, Alan; Klem, John Frederick; Briggs, Ronald D.; Clevenger, Jascinda; Patrizi, Gary A.

Abstract not provided.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1143307
• Report Number(s): SAND2014-3965C; 517708
• Resource Relation: Conference: Proposed for presentation at the 225th Electrochemical Society Meeting held May 11-15, 2014 in Orlando, FL.
• Country of Publication: United States
• Language: English