Skip to main content
OSTI.GOVU.S. Department of Energy Office of Scientific and Technical Information
U.S. Department of Energy
Office of Scientific and Technical Information
 

Computational modeling : on the critical path for predicting solder joint reliability.

Conference ·
OSTI ID:1049468
;

No abstract prepared.

Research Organization:
Sandia National Laboratories
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1049468
Report Number(s):
SAND2012-3967C
Country of Publication:
United States
Language:
English

Similar Records

Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.
Conference · Wed Apr 01 00:00:00 EDT 2015 · OSTI ID:1248708
Reliability Analysis of Pin-in-Hole Solder Joints by Computational Modeling.
Conference · Wed Apr 01 00:00:00 EDT 2015 · OSTI ID:1247091
Modeling the Aging and Reliability of Solder Joints.
Conference · Wed Jul 01 00:00:00 EDT 2009 · OSTI ID:1142136

Related Subjects

36 MATERIALS SCIENCE
JOINTS
RELIABILITY
SIMULATION
SOLDERING