D0 Silicon Upgrade: Thermal Contraction Analysis of the Solenoid and VLPC Cryogenic Transfer Lines for the DØ Upgrade
- Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
The stresses developed in the solenoid and VLPC transfer lines have been investigated with the PipePlus v4.5 software package from Algor. 4 cases were considered for each transfer line and the following results were obtained.
- Research Organization:
- Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 1033306
- Report Number(s):
- FERMILAB-D0-EN--425
- Country of Publication:
- United States
- Language:
- English
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