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Temperature cycling of Pb-free and mixed solder interconnections used on a package-on-package test vehicle.

Conference ·
OSTI ID:1028406
 [1];  [1]; ; ; ;
  1. ACI Technologies, Inc., Philadelphia, PA
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Abstract Not Provided

Research Organization:
Sandia National Laboratories
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1028406
Report Number(s):
SAND2010-7499C
Country of Publication:
United States
Language:
English

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